ATE testing system and method for millimetre wave packaged integrated circuits

A testing system for millimeter wave (mmW) packaged integrated circuits comprises:

• a packaged integrated circuit;
• a radio frequency (RF) socket configured to receive the packaged integrated circuit and facilitate routing RF signals thereto via an input connector and an output connector;
• and
• an interface configured to couple a tester to the packaged integrated circuit,
• wherein the RF socket comprises a shield comprising a hole for locating over a corresponding RF signal carrying pin and an extended contiguous cut-out area located adjacent RF signal carrying pins and revealing more than one RF signal carrying pin to provide isolation between respective input-output ports within and between the packaged integrated circuit.

A method for testing a millimeter wave (mmW) packaged integrated circuit (IC) connectable to a radio frequency (RF) socket, the method comprising:

• matching an RF socket input connector or an RF socket output connector to an output impedance of the mmW packaged IC;
• constructing a validation board with a matched termination;
• and
• incorporating an interface for connecting the RF socket input connector or the RF socket output connector to a test equipment,
• wherein the matching comprises creating a hole for locating over a corresponding RF signal carrying pin and creating an extended contiguous cut-out area in a shielding connected to the mmW packaged IC located adjacent RF signal carrying pins and revealing more than one RF signal carrying pin,
• wherein the RF socket includes a mmW absorber located adjacent the output connector of the RF socket to provide isolation between respective input-output ports within and between the packaged IC.