Semiconductor micro probe array having compliance
AssigneeInternational Business Machines Corporation
InventorEugene R. Atwood
Life of this patent
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Abstract
A die probe including a probe tip operably connected to a first surface of a thin film; a metal trace, wherein a first portion of the metal trace is operably connected to a second surface of the thin film, the second surface of the thin film opposite the first surface of the thin film; and an upper space transformer, wherein a second portion of the metal trace is operably connected to the upper space transformer, wherein a pressurized liquid and/or gas is configured to expand a space between the second surface of the thin film and the upper space transformer.
Claims15
A die probe comprising:
- a probe tip operably connected to a first surface of a thin film;
- a metal trace comprising a first end, a second end and a middle portion between the first end and the second end, wherein the middle portion of the metal trace is operably connected to a second surface of the thin film, the second surface of the thin film opposite the first surface of the thin film;
- an upper space transformer, wherein both the first end and the second end of the metal trace are in physical contact with a first surface of the upper space transformer, wherein a pressurized liquid and/or gas is configured to expand a space between the second surface of the thin film and the upper space transformer, wherein the metal trace is configured to vertically expand and vertically contract between an expanded state and an unexpanded state, and wherein the probe tip is configured to move closer to, and further from, the upper space transformer;
- and
- a release layer of material on the first surface of the upper space transformer.
A die probe comprising:
- a probe tip operably connected to a first surface of a thin film;
- a metal trace comprising a first end, a second end and a middle portion between the first end and the second end, wherein the middle portion of the metal trace is operably connected to a second surface of the thin film, the second surface of the thin film opposite the first surface of the thin film;
- an upper space transformer, wherein both the first end and the second end of the metal trace are operably connected to a first surface of the upper space transformer, wherein a pressurized liquid and/or gas is configured to expand a space between the second surface of the thin film and the upper space transformer, wherein the metal trace is configured to vertically expand and vertically contract between an expanded state and an unexpanded state, and wherein the probe tip is configured to move closer to, and further from, the upper space transformer, wherein, in the expanded state, the middle portion is nearer the probe tip than either of the first end or the second end;
- and
- a release layer of material on the first surface of the upper space transformer.
Dependencies are inferred from the claim text.