Sensor system and method
AssigneeGeneral Electric Company
InventorsJoseph Alfred Iannotti, Christopher James Kapusta, David Richard Esler
Life of this patent
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Abstract
A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
Claims21
A system comprising:
- an inlay disposed in a recess defined along a surface of a structure, wherein the inlay is a different material than a material of the structure surrounding the inlay;
- a structure bonding layer disposed on an outer surface of the inlay, wherein the structure bonding layer is a metallic alloy;
- and
- a sensor including a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer, wherein the sensor bonding layer is a metallic alloy;
- wherein the sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
A method comprising:
- depositing an inlay in a recess defined within a surface of a structure, wherein the inlay is a different material than a material of the structure surrounding the inlay;
- disposing a structure bonding layer on an outer surface of the inlay, wherein the structure bonding layer is a metallic alloy;
- disposing a sensor bonding layer on a surface of a non-metallic wafer of a sensor, wherein the sensor bonding layer is a metallic alloy;
- and
- coupling the structure bonding layer to the sensor bonding layer via a metallic joint, wherein the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
A system comprising:
- a sensor including a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy;
- an inlay disposed on a curved surface of a structure, wherein the inlay comprises a metal foam and has a planar outer surface;
- and
- a structure bonding layer disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy,
- wherein the sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
Dependencies are inferred from the claim text.