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US 11,079,282 B2Granted
Flexible interconnect sensing devices and related methods
AssigneeSemiconductor Components Industries, LLC
InventorsIrfan Rahim, Oswald L. Skeete, Ross F. Jatou
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Abstract
Implementations of sensing devices may include a plurality of electromagnetic radiation sensing sections coupled to a flexible interconnect and one or more digital sections coupled to the flexible interconnect. The plurality of electromagnetic radiation sensing sections may be self-aligned through the flexible interconnect.
Claims8
A method of forming an electromagnetic radiation (EMR) sensing device comprising:
- forming a plurality of EMR sensing die in a first side of substrate;
- forming a trench partially through the substrate from the first side of the substrate through removing a portion of the substrate between two EMR sensing die of the plurality of EMR sensing die;
- coupling a support layer to the first side of the substrate;
- singulating the plurality of EMR sensing die through thinning a second side of the substrate opposite the first side of the substrate;
- coupling the second side of the substrate to a flexible interconnect;
- removing at least a portion of the support layer to fully singulate the plurality of EMR sensing die;
- and
- bending the flexible interconnect at portions of the flexible interconnect corresponding with a location of the trench.
5 more elements
Dependencies are inferred from the claim text.