Pumping apparatus and method for substrate processing chambers

A pumping ring for substrate processing chambers, comprising:

• a top surface, an upper wall, a lower wall, an inner radial wall, and an outer radial wall;
• one or more openings configured to direct a fluid therethrough;
• a first exhaust port;
• a second exhaust port, the first exhaust port and the second exhaust port defining a linear axis therebetween;
• a first baffle disposed adjacent the first exhaust port;
• and
• a second baffle disposed adjacent the second exhaust port, the first baffle and the second baffle disposed at a baffle angle measured between an end of the respective first or second baffle and the linear axis, wherein the baffle angle is within a range of about 0.01 degrees to about 55 degrees.

A substrate processing chamber, comprising:

• a chamber body;
• a pedestal disposed in the chamber body;
• a pumping ring disposed around the pedestal, the pumping ring comprising an upper wall, a lower wall, an inner radial wall, and an outer radial wall;
• an annulus defined by the upper wall, the lower wall, the inner radial wall, and the outer radial wall;
• a first exhaust port in the pumping ring that is fluidly coupled to the annulus;
• a second exhaust port in the pumping ring that is fluidly coupled to the annulus, the first exhaust port and the second exhaust port defining a linear axis therebetween;
• a first baffle disposed in the annulus adjacent the first exhaust port;
• and
• a second baffle disposed in the annulus adjacent the second exhaust port, the first baffle and the second baffle disposed at a baffle angle measured between an end of the respective first or second baffle and the linear axis, wherein the baffle angle is within a range of about 0.01 degrees to about 55 degrees;
• and
• a foreline that is fluidly coupled to the first exhaust port and the second exhaust port.