US 11,077,698 B2Granted

Volume hologram sheet to be embedded, forgery prevention paper, and card

AssigneeDai Nippon Printing Co., Ltd.

InventorsNobuko Oikawa, Minoru Azakami

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Abstract

An object of the present invention is to provide a thin volume hologram sheet to be embedded sufficiently resistant to a mechanical stress such as a stress including a tensile stress, a shear stress and a compression stress at the time of processing even under a heating condition, a forgery prevention paper and a card using the same. The object is achieved by providing a volume hologram sheet to be embedded comprising a volume hologram layer, and a substrate disposed only on one side surface of the volume hologram layer using an adhesion means, wherein a peeling strength of the volume hologram layer and the substrate is 25 gf/25 mm or more.

Claims8

Dependent claims

A card comprising

a core sheet,
a volume hologram sheet, and,
a over sheet,
wherein the volume hologram sheet is embedded between the core sheet and the over sheet,
wherein the volume hologram sheet consisting of a volume hologram layer, a substrate, and an adhesion means,
a film thickness of the volume hologram sheet in a range of 20 μm to 50 μm,
the core sheet and the over sheet are made from similar materials,
a peeling strength of the volume hologram layer and the substrate is 144 gf/25 mm or more, and
wherein the adhesive means is laminated in between a first surface of the volume hologram layer and the substrate, and a second surface of the volume hologram layer is in direct contact with the core sheet with no adhesive material between the second surface of the volume hologram layer and the core sheet.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/376,410Filed 5 Apr 2019 · continuation
Priority: JP 2010-00941719 Jan 2010
Published: US 2019/0232709 A11 Aug 2019
Granted: 3 Aug 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification74 codes

B42D 25/328
Identification or security features, e.g. for preventing forgery: diffraction gratings; Holograms
B29C 65/48
Joining or sealing of preformed parts , e.g. welding of plastics materials; Apparatus therefor: using adhesives , i.e. using supplementary joining…
B29C 65/482
Non-reactive adhesives, e.g. physically hardening adhesives: drying adhesives, e.g. solvent based adhesives
B29C 65/483
Characterised by the type of adhesives: reactive adhesives, e.g. chemically curing adhesives

Family

PCT/JP2011/050765Parent of this continuation · filed 18 Jan 2011
Application15/435,973Parent of this continuation · filed 17 Feb 2017
US 2019/0232709 A1Pre-grant publication · published 1 Aug 2019
Application13/521,757Parent of this continuation
US 2012/0286504 A1Published application
US 2017/0157971 A1Published application
US 11,077,698 B2This patent

From the US filing history. Foreign family members aren’t listed.

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