Liquid discharge head and liquid discharge apparatus

A liquid discharge head, comprising:

• a plurality of pressure generating elements configured to generate pressure to discharge a liquid;
• a plurality of wirings configured to transmit a drive signal to the plurality of pressure generating elements, respectively;
• a plurality of integrated circuits configured to drive the plurality of pressure generating elements, respectively, the plurality of integrated circuits being provided on the plurality of wirings, respectively;
• and
• a heat sink configured to contact the plurality of integrated circuits to dissipate heat in the plurality of integrated circuits,
• wherein the heat sink includes:
• a first dissipation part that directly contacts one of the plurality of integrated circuits;
• and
• a second dissipation part that contacts another of the plurality of integrated circuits via one of the plurality of wirings, and
• a thermal resistance of the first dissipation part s larger than a thermal resistance of the second dissipation part.

A liquid discharge head, comprising:

• a plurality of pressure generating elements configured to generate pressure to discharge a liquid;
• a plurality of wirings configured to transmit a drive signal to the plurality of pressure generating elements, respectively;
• a plurality of integrated circuits including a first integrated circuit configured to drive a first pressure generating element of the plurality of pressure generating elements and a second integrated circuit configured to drive a second pressure generating element of the plurality of pressure generating elements, the plurality of integrated circuits being provided on the plurality of wirings, respectively;
• and
• a heat sink configured to contact the plurality of integrated circuits to dissipate heat in the plurality of integrated circuits,
• wherein the heat sink includes:
• a first dissipation part that directly contacts the first integrated circuit;
• and
• a second dissipation part that contacts the second integrated circuit via one of the plurality of wirings,
• a thermal resistance of the first dissipation part is different from a thermal resistance of the second dissipation part, and
• wherein a material of the first dissipation part is different than a material of the second dissipation part.