Method and process to laminate substrates using an adhesive tape
AssigneeMarotech Inc.
InventorMartin Robitaille
Life of this patent
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AssigneeMarotech Inc.
InventorMartin Robitaille
Estimating the term…
The present invention discloses a method and process to laminate packaging substrates using an adhesive tape. The tape has a first heat activated adhesive which is activatable at a first temperature and a second heat activated adhesive which is activatable at a second temperature and both of which are alternatively coated on at least one surface of the tape. The method consists of laminating this aforementioned tape to a packaging substrate by following the process of: placing this tape in or on a laminating machine over the packaging substrate, heating the tape at least to the second temperature while making contact with the packaging substrate, cooling the packaging laminate until the second heat activated adhesive is set and cutting a predetermined portion of the packaging laminate before a second adhesive occurs between the tape and the packaging laminate.
A method for laminating a tape having a first heat activated adhesive which is activatable at a first temperature and a second heat activated adhesive which is activatable at a second temperature being higher than the first temperature, wherein the first heat activated adhesive and the second heat activated adhesive are coated in alternating bands at least on one surface of the tape, to a packaging substrate, the process comprising the steps of:
A process for producing a packaging laminate comprising the following steps:
Dependencies are inferred from the claim text.