Laser processing apparatus, methods of laser-processing workpieces and related arrangements

An apparatus for laser-processing a workpiece comprising an electrical conductor structure in thermal contact with a dielectric structure, the apparatus comprising:

• a laser source configured to generate a plurality of laser pulses;
• a scan lens arranged in a beam path along which the plurality of laser pulses are directable to the workpiece to thereby irradiate a process spot at the workpiece;
• a first positioner including an acousto-optical deflector (AOD) system arranged along the optical path between the laser source and the scan lens, wherein the first positioner is operative to deflect the plurality of laser pulses relative to the scan lens;
• a controller communicatively coupled to the first positioner and configured to control an operation of the first positioner, wherein the controller includes:
• a processor configured to generate one or more control signals to which the first positioner is responsive;
• and
• computer memory accessible by the processor, wherein the computer memory has instructions stored thereon which, when executed by the processor, cause the first positioner to scan the process spot along a process trajectory to form a via in the workpiece, wherein the process trajectory defines a sequence of spot locations to be addressed upon irradiating the workpiece with the plurality of laser pulses during formation of the via and wherein the controller is configured to control the operation of the first positioner to form the via such that the laser pulses irradiating the workpiece at the sequence of spot locations:
• a) vaporize a first region of the dielectric structure at the surface, thereby generating a high-pressure region between the first region of the dielectric structure and a first region of the electrical conductor structure, and
• b) heat the first region of the electrical conductor structure such that at least a portion of the heated first region of the electrical conductor structure is ejectable from the workpiece by the high-pressure region.