Back to results
US 11,029,597 B2Granted
Method for producing pattern laminate, method for producing reversal pattern, and pattern laminate
AssigneeFUJIFILM Corporation
InventorsYuichiro Goto, Kazuhiro Marumo
Life of this patent
Estimating the term…
Abstract
Provided are a method for producing a pattern laminate, the pattern laminate having a first layer having a pattern on an object to be processed and a second layer, which has a small waviness after etching (ΔLWR), in which the method includes a step of forming a first layer having a pattern on an object to be processed and a step of forming a second layer on the first layer, and the glass transition temperature of the first layer is 90° C. or higher; a method for producing a reversal pattern; and a pattern laminate.
Claims10
A method for producing a pattern laminate, comprising:
- forming a first layer having a pattern on an object to be processed;
- and
- forming a second layer on the first layer,
- wherein the glass transition temperature of the first layer is 100° C. or higher,
- the forming of a first layer includes forming a first layer by an imprint method using a first curable composition comprising a polymerizable compound having an ethylenically unsaturated bond-containing group,
- a proportion of the polymerizable compound having an ethylenically unsaturated bond-containing group which includes an aliphatic ring having a crosslinked structure, with respect to all polymerizable compounds included in the first curable composition, is less than 15% by mass,
- a proportion of a polymerizable compound having two ethylenically unsaturated bond-containing groups with respect to all polymerizable compounds included in the first curable composition is 50% or more by mass,
- a proportion of a polymerizable compound having one ethylenically unsaturated bond-containing group with respect to all polymerizable compounds included in the first curable composition is 10 to 35% by mass,
- an Onishi parameter of the first curable composition is less than 3.8,
- the second layer includes a Si atom-containing compound or a metal, and
- the forming of a second layer includes forming a second layer by curing a second curable composition including a Si atom-containing compound in a case where the second layer includes the Si atom-containing compound.
8 more elements
Dependencies are inferred from the claim text.