Frame lid for in-package optics

A method for attaching a frame assembly to a circuit package comprising a substrate, a first Electronic Integrated Circuit (EIC) mounted to the substrate and a second EIC, the method comprising:

• applying an adhesive to the substrate;
• applying a first thermal interface material to a first surface of the first EIC;
• applying a second thermal interface material to a second surface of the second EIC;
• placing a first frame lid onto the circuit package, wherein a foot of the first frame lid contacts the adhesive, a roof of the first frame lid contacts the first thermal interface material, and the second thermal interface material is exposed by a port defined in the roof and placing the first frame lid onto the circuit package comprises:
• inserting an optical fiber through a slot defined in a wall of the first frame lid;
• and
• sliding the first frame lid along a length of the optical fiber until the foot is in contact with the adhesive;
• placing a second frame lid through the port to contact the second thermal interface material, wherein the second frame lid is thermally isolated from the first frame lid;
• and
• curing the adhesive, the first thermal interface material, and the second thermal interface material to bond the first frame lid and the second frame lid onto the circuit package and to seal the port.

A method for attaching a frame assembly to a circuit package comprising a substrate, a first Electronic Integrated Circuit (EIC) mounted to the substrate at a first height relative to the substrate and a second EIC mounted to the substrate at a second height, less than the first height, relative to the substrate, the method comprising:

• applying an adhesive to the substrate;
• applying a first thermal interface material to a first surface of the first EIC;
• applying a second thermal interface material to a second surface of the second EIC;
• placing a first frame lid onto the circuit package, wherein a foot of the first frame lid contacts the adhesive in a first plane parallel to the substrate, a roof of the first frame lid contacts the first thermal interface material in a second plane parallel to the first plane, and the second thermal interface material is exposed by a port defined in the roof;
• placing a second frame lid through the port to contact the second thermal interface material in a third plane parallel to the second plane, wherein the second frame lid is thermally isolated from the first frame lid;
• and
• curing the adhesive, the first thermal interface material, and the second thermal interface material to bond the first frame lid and the second frame lid onto the circuit package and to seal the port.