Low force wafer test probe

A method for conducting a low force wafer test, the method comprising:

• providing a wafer test probe configured to minimize stress that occurs during engagement with a contact of a wafer, the wafer test probe comprising:
• a pedestal having a first end and a second end, the pedestal comprising a cavity that extends from a first planar surface of the first end towards the second end;
• and
• three blades extending from a periphery of the cavity to a central longitudinal axis of the pedestal, the three blades configured to engage a surface of a contact at a position offset from a central longitudinal axis of the contact, each of the three blades comprising a first surface coplanar to the first planar surface and a second surface parallel to the central longitudinal axis of the pedestal, wherein the three blades are positioned within the cavity such that the three blades and the cavity provide a 120-degree rotational symmetry about the central longitudinal axis of the pedestal;
• and
• engaging the wafer test probe with a surface of the contact such that a portion of the contact is received within the cavity.