Integrated circuit comprising multiple channels with integrated bypass capacitors and photodiodes

A system, comprising:

• a first electronic device that includes:
• a first photodiode, a first capacitor coupled to the first photodiode and disposed in a first channel formed in the first electronic device, to assist with biasing the first photodiode, a second photodiode, a second capacitor coupled to the a second photodiode and disposed in a second channel formed in the first electronic device, to assist with biasing the second photodiode, wherein the first and second channels of the PIC are formed adjacent to each other, wherein a channel-to-channel pitch between the first and second channels is equal to a pitch between corresponding adjacent first and second channels on an integrated circuit (IC), wherein the first electronic device and the IC are to be coupled to form a resulting data channel, wherein the first channel formed on the first electronic device is to be coupled to the corresponding first channel on the IC, and the second channel formed on the first electronic device is to be coupled to the corresponding second channel on the IC, wherein the first photodiode and the first capacitor have respective first and second sizes that are less than a first size of the first channel, in order for the first channel to accommodate the first photodiode and the first capacitor, and wherein the second photodiode and the second capacitor have respective third and fourth sizes that are less than a second size of the second channel, in order for the second channel to accommodate the second photodiode and the second capacitor, and wherein the first electronic device further includes a temperature sensor, to sense a temperature of the first electronic device;
• and
• a second electronic device that includes a microcontroller, wherein the microcontroller is to adjust a bias voltage of the photodiode, based at least in part on temperature readings provided by the temperature sensor of the first electronic device.

A computing device, comprising:

• a processor;
• and
• a receiver coupled with the processor, wherein the receiver includes at least first and second channels that are formed adjacent to each other in a photonic integrated circuit (PIC) that includes the receiver, wherein a channel-to-channel pitch between the first and second channels is equal to a pitch between corresponding adjacent first and second channels on an integrated circuit (IC), wherein the PIC and the IC are to be coupled to form a resulting data channel, wherein the first channel formed on the PIC is to be coupled to the corresponding first channel on the IC, and the second channel formed on the PIC is to be coupled to the corresponding second channel on the IC, wherein the first channel includes a first photodiode and a first capacitor coupled to the first photodiode, and the second channel includes a second photodiode and a second capacitor coupled with the second photodiode, wherein the first photodiode and the first capacitor have respective first and second sizes that are less than a first size of the first channel of the PIC, in order for the first channel to accommodate the first photodiode and the first capacitor, and wherein the second photodiode and the second capacitor have respective third and fourth sizes that are less than a second size of the second channel of the PIC, in order for the second channel to accommodate the second photodiode and the second capacitor,
• wherein the first and second capacitors are provided to assist with biasing the first and second photodiodes respectively and to isolate a signal output by the first and second photodiodes from interference provided by a power supply associated with the receiver.