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US 11,028,495 B2Granted
Method for producing porous copper foil and porous copper foil produced by the same
AssigneeYmt Co., Ltd.
InventorsSung Wook Chun, Ik Beom Kim, Seon Gi Jeon, Dae Hoon Lee, Youn Bong Kang, Jun Mo Hong, Hyeong Gyu Park
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Abstract
Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
Claims3
A method for producing a porous copper foil, comprising:
- forming a release layer on a metal carrier, wherein the metal carrier is made of aluminum with a natural surface oxide film and the release layer is composed of a metal compound having a thickness of 10 nanometers or less;
- growing copper islands on the metal carrier formed with the release layer by electroless copper plating;
- forming a porous copper thin layer by copper electroplating using the metal carrier with the natural surface oxide film as an electrode to electroplate only the copper islands;
- and
- peeling off the porous copper thin layer from the release layer.
2 more elements
A method for manufacturing a polymer resin sheet with surface irregularities, comprising:
- forming a release layer on a metal carrier, wherein the metal carrier is made of aluminum with a natural surface oxide film and the release layer is composed of a metal compound layer having a thickness of 10 nanometers or less;
- growing copper islands on the metal carrier formed with the release layer by electroless copper plating;
- forming a porous copper thin layer by copper electroplating using the metal carrier with the natural surface oxide film as an electrode to electroplate only the copper islands;
- applying a curable polymer onto the porous copper thin layer and curing the curable polymer;
- peeling off the cured polymer and the porous copper thin layer from the release layer;
- and
- removing the copper from the cured polymer and the porous copper thin layer.
4 more elements
Dependencies are inferred from the claim text.