Etching composition, method for etching insulating layer of semiconductor devices and method for preparing semiconductor devices

Abstract

An etching composition is provided. The etching composition includes phosphoric acid, phosphoric anhydride, a silane compound represented by Formula 1 below and water: wherein R1 to R6 are independently hydrogen, halogen, a substituted or unsubstituted C1-C20 hydrocarbyl group, a C1-C20 alkoxy group, a carboxy group, a carbonyl group, a nitro group, a tri(C1-C20-alkyl)silyl group, a phosphoryl group, or a cyano group. L is a direct bond or C1 to C3 hydrocarbylene, and A is an n-valent radical, while n is an integer of 1 to 4.

Dependencies are inferred from the claim text.