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US 11,028,269 B2Granted
Silicone-modified epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsNorifumi Kawamura, Shoichi Osada, Kohei Otake
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Abstract
The invention provides a resin composition comprising a specific silicone-modified epoxy resin, a specific silicone-modified phenolic resin, black pigment, and an inorganic filler. The invention also provides a resin composition comprising a specific cyanate ester compound, a specific silicone-modified epoxy resin, and a specific phenol compound and/or silicone-modified phenolic resin.
Claims3
A silicone-modified epoxy resin composition comprising:
- (A) a silicone-modified epoxy resin obtained from hydrosilylation reaction of an alkenyl-containing epoxy compound with an organopolysiloxane having the average compositional formula (1):
- HaRbSiO(4-a-b)/2 (1)
- wherein R is each independently a C1-C10 monovalent hydrocarbon group, a is a positive number:
- 0.01≤a≤1, b is a positive number:
- 1≤b≤3, and 1.01≤a+b<4,
- (B) a silicone-modified phenolic resin obtained from hydrosilylation reaction of an alkenyl-containing phenol compound with an organopolysiloxane having the average compositional formula (1),
- (C) a black pigment, and
- (D) an inorganic filler exclusive of the black pigment (C),
- wherein the silicone-modified epoxy resin of component (A) has the following formula (5):
- and wherein the silicone-modified phenolic resin of component (B) has the following formula (7)
7 more elements
Dependencies are inferred from the claim text.