Resin composition, anisotropic conductive film including the same, and electronic device

A resin composition comprising:

• conductive particles;
• a resin component;
• and
• a curing agent,
• wherein the conductive particles consist of solder,
• the solder contains at least one selected from the group consisting of a tin-bismuth alloy, a tin-bismuth-indium alloy and a bismuth-indium alloy,
• the resin component contains an epoxy resin and a phenoxy resin,
• the curing agent contains a first compound having at least one thiol group and a second compound having an amino group,
• a total amount of the epoxy resin and the phenoxy resin in the resin component is 90 mass % or more,
• an amount of the phenoxy resin is 30 parts by mass to 50 parts by mass relative to 100 parts by mass of the epoxy resin,
• an amount of the first compound is 35 parts by mass to 70 parts by mass relative to 100 parts by mass of the epoxy resin,
• an amount of the second compound is 3 parts by mass to 20 parts by mass relative to 100 parts by mass of the epoxy resin, and
• an amount of the conductive particles is 3 mass % to 30 mass % relative to a total mass of the resin composition being taken as 100 mass %.