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US 11,028,251 B2Granted
Resin composition, film, infrared cut filter, method of manufacturing infrared cut filter, solid image pickup element, infrared sensor, and camera module
AssigneeFUJIFILM Corporation
InventorsSuguru Samejima, Kyohei Arayama, Kazutaka Takahashi
Life of this patent
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Abstract
Provided is a resin composition including: an infrared absorbing pigment; and a resin having an infrared absorbing group. In addition, provided are a film that is formed using the resin composition, an infrared cut filter, a method of manufacturing an infrared cut filter, a solid image pickup element, an infrared sensor, and a camera module.
Claims29
A resin composition comprising:
- an infrared absorbing pigment;
- and
- a resin having an infrared absorbing group;
- wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure.
1 more element
An infrared cut filter comprising:
- a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group;
- wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure.
A method of manufacturing an infrared cut filter comprising:
- forming a layer that includes an infrared absorbing pigment and a resin having an infrared absorbing group on a support;
- forming a photoresist layer on the layer;
- obtaining a resist pattern by patterning the photoresist layer by exposure and development;
- and
- dry-etching the layer by using the resist pattern as an etching mask.
2 more elements
A solid image pickup element comprising:
- a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group;
- wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure.
An infrared sensor comprising:
- a film that includes an infrared absorbing pigment and a resin having an infrared absorbing group;
- wherein the infrared absorbing group is a group having at least one structure selected from the group consisting of a pyrrolopyrrole structure, a diimmonium structure, a rylene structure, a dithiol complex structure, a triarylmethane structure, an azomethine structure, an anthraquinone structure, a dibenzofuranone structure, an oxonol structure, a squarylium structure, a croconium structure, a phthalocyanine structure, a naphthalocyanine structure, a pyrylium structure, an azulenium structure, a pyrromethene structure, and a cyanine structure.
Dependencies are inferred from the claim text.