Relating to structural adhesives

An adhesive for providing corrosion resistance to a substrate to which the adhesive is adhered, the adhesive comprising:

• a) from about 25% to about 50%, by weight of the adhesive, epoxy resin with about 25% to about 75%, by weight of the epoxy resin, being high molecular weight resin, the high molecular weight resin including a phenoxy resin;
• b) from about 10% to about 25%, by weight of the adhesive, core/shell impact modifier;
• and
• c) from about 0.5% to about 10%, by weight of the adhesive, curing agent;
• wherein the adhesive is reformable from about 60° C. to about 120° C., and wherein the adhesive is curable from about 125° C. to about 230° C.;
• wherein a temperature range in which GI>GII is from about 10° C. to about 50° C.;
• wherein a temperature range in which GII>GI is from about 80° C. to about 120° C.;
• wherein the adhesive is free from crosslinking below 125° C.;
• wherein the epoxy resin comprises a solid epoxy resin and a liquid epoxy resin;
• and
• wherein a ratio of the solid epoxy resin to the epoxy resin is from about 1:9 to about 1:16, by weight.