Load cup and chemical mechanical polishing apparatus and method of manufacturing including the same

A method of manufacturing a semiconductor device using chemical mechanical polishing, the method comprising:

• providing a base part having a polishing pad and a load cup;
• providing a polishing head,
• wherein the load cup comprises:
• a pedestal having a seating surface on which a wafer is seated,
• a cup having the pedestal disposed therein, and
• a plurality of arrangement parts disposed around the pedestal;
• placing a wafer on the pedestal;
• lowering the pedestal within the load cup;
• moving the arrangement parts horizontally in a direction toward a center of the pedestal,
• wherein as a result of the moving:
• a polishing head connection portion of each arrangement part contacts a lateral surface of the polishing head,
• a wafer fixation portion of each arrangement part contacts a lateral surface of the wafer, and
• the wafer is aligned with the polishing head;
• picking up the wafer with the polishing head;
• and
• performing a polishing process on a layer formed on the wafer.

A method of manufacturing a semiconductor device using a chemical mechanical polishing apparatus, the method comprising:

• providing a base part having a load cup, the load cup including a pedestal having a seating part for mounting a wafer and a cup in which the pedestal is received and having an upper surface with a through hole;
• inserting a polishing head in the through hole;
• providing a plurality of alignment parts having a plurality of respective fastening portions and a plurality of respective alignment part bodies disposed around the pedestal;
• using a plurality of respective driving parts, moving the plurality of alignment parts horizontally in a direction toward a center of the pedestal;
• rotating or reciprocating alignment part bodies coupled to the plurality of fastening portions, respectively, so as to contact a lateral surface of the polishing head, and adjust a center of the wafer to be aligned with a center of the polishing head;
• picking up the wafer with the polishing head;
• and
• performing a polishing process on a layer formed on the wafer.