US 11,027,275 B2Granted

Method for fabricating microfluidic structures

AssigneeNational Tsing Hua University

InventorsChien-Chong Hong, Shih-Hong You, Wen Chung

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Abstract

A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Claims3

Dependent claims

A method for fabricating microfluidic structures, comprising:

providing a first belt and forming an adhesion layer on at least one surface of the first belt;
cutting the first belt for forming a first microfluidic channel, wherein the first microfluidic channel comprises a first depth;
providing a second belt and forming an adhesion layer on at least one surface of the second belt;
cutting the second belt for forming a second microfluidic channel, wherein the second microfluidic channel comprises a second depth;
adhering the first belt and the second belt via the adhesion layer of the first belt and the adhesion layer of the second belt;
and
stacking the first belt and the second belt in order to stack the first depth and the second depth.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 16/748,812Filed 22 Jan 2020 · division
Priority: TW 10310213021 Jan 2014
Published: US 2020/0156064 A121 May 2020
Granted: 8 Jun 2021
Term ends: Not estimatedThe source records don’t support an estimate.

Classification20 codes

B01L 3/502707
By integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g.…
B32B 37/12
Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding: characterised by using adhesives
B32B 37/18
With all layers existing as coherent layers before laminating: involving the assembly of discrete sheets or panels only
B32B 38/0004
Ancillary operations in connection with laminating processes: cutting, tearing or severing, e.g. bursting; Cutter details

Family

Application14/266,820Parent of this division · filed 30 Apr 2014
Application15/582,750Parent of this division · filed 30 Apr 2017
US 9,682,374 B2Parent of this division · filed 20 Jun 2017
US 2020/0156064 A1Pre-grant publication · published 21 May 2020
US 10,576,469 B2Parent of this division
US 2015/0202625 A1Published application
US 2017/0232438 A1Published application
US 11,027,275 B2This patent

From the US filing history. Foreign family members aren’t listed.

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