Semiconductor refrigeration cup
AssigneeXiamen Paltier Electronic Technology Co., Ltd
InventorsZonghu Zhu, Xianyan Long, Chunyan Lu
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Abstract
A semiconductor refrigeration assembly includes a semiconductor refrigeration assembly, a heat-dissipation member, a cup body, and a base. The semiconductor refrigeration assembly is embedded in the bottom wall of the cup body and has an end exposed out of the cup body. The heat-dissipation member is arranged over the bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly. The base is configured to support the heat-dissipation member and to supply power to the semiconductor refrigeration assembly. The semiconductor refrigeration cup has a better heat-dissipation effect.
Claims6
A semiconductor refrigeration cup, comprising a semiconductor refrigeration assembly, a heat-dissipation member, a cup body, and a base, wherein the semiconductor refrigeration assembly is embedded in a bottom wall of the cup body and has an end exposed out of the cup body;
- the heat-dissipation member is arranged over a bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly;
- the base is configured to support the heat-dissipation member and to supply power to the semiconductor refrigeration assembly;
- and
- an air duct communicated with an outside and a fan disposed in the air duct are arranged in the base, and an air outlet of the air duct faces the heat-dissipation member;
- wherein an electrode pin is arranged on a supporting face, used for supporting the heat-dissipation member, of the base, a conductive electrode corresponding to the electrode pin is arranged on the heat-dissipation member and is electrically connected to the semiconductor refrigeration assembly, and the electrode pin is electrically connected to a preset external power supply.
A semiconductor refrigeration cup, comprising a semiconductor refrigeration assembly, a heat-dissipation member, a cup body, and a base, wherein the semiconductor refrigeration assembly is embedded in a bottom wall of the cup body and has an end exposed out of the cup body;
- the heat-dissipation member is arranged over a bottom of the cup body and abuts against the end, located outside the cup body, of the semiconductor refrigeration assembly;
- the base is configured to support the heat-dissipation member and to supply power to the semiconductor refrigeration assembly;
- and
- an air duct communicated with an outside and a fan disposed in the air duct are arranged in the base, and an air outlet of the air duct faces the heat-dissipation member,
- wherein the cup body comprises an inner container, a shell, and an insulation layer clamped between the inner container and the shell, and the semiconductor refrigeration assembly has an end attached to an outer surface of a bottom wall of the inner container.
Dependencies are inferred from the claim text.