Techniques for routing electrical signals through electrical components and related methods

A printed circuit board, comprising:

• a dielectric core;
• a trace including electrically conductive material supported on a first major surface of the dielectric core;
• a dielectric material located on a second, opposite major surface of the dielectric core;
• another quantity of the dielectric material located on the first major surface of the dielectric core partially over the trace;
• a pattern of holes extending from the dielectric core at least partially through the dielectric material, footprints of at least some of the holes of the pattern of holes at least partially laterally overlapping with a width of the trace, the pattern of holes extending along at least a majority of a length of the trace;
• and
• another pattern of holes defined by the other quantity of the dielectric material and extending from the dielectric material and the electrically conductive material at least partially through the other quantity of the dielectric material, other footprints of at least some of the holes of the other patterns of holes at least partially laterally overlapping with the trace;
• wherein each of the pattern of holes and the other pattern of holes remains free of occupying material within the pattern of holes and the other pattern of holes.

A method of making a substrate, comprising:

• removing portions of electrically conductive material located on a first major surface of a dielectric core, leaving a trace of the electrically conductive material on the first major surface;
• forming a series of voids extending at least partially through a dielectric material by removing portions of the dielectric material to leave the voids;
• placing the dielectric material adjacent to a second major surface of the dielectric core located on a side of the dielectric core opposite the trace, footprints of at least some of the voids of the series of voids at least partially laterally overlapping with the trace;
• forming another series of voids extending at least partially through another quantity of the dielectric material by removing portions of the other quantity of the dielectric material to leave the other series of voids;
• placing the other quantity of the dielectric material adjacent to the first major surface of the dielectric core located on a same side of the dielectric core as the trace, footprints of at least some of the voids of the other series of voids at least partially laterally overlapping with the trace;
• securing the dielectric material and the other quantity of the dielectric material to the dielectric core;
• and
• leaving each of the series of voids and the other series of voids free of occupying material within the series of voids and the other series of voids.

An intermediate product in a method of making a substrate configured to route electrical signals, comprising:

• a first stratum, the first stratum comprising:
• a first dielectric material;
• an electrically conductive material located on a first side of the first dielectric material;
• a second dielectric material located on a second, opposite side of the first dielectric material;
• and
• a series of voids defined by the second dielectric material extending from the first dielectric material at least partially through the second dielectric material, footprints of at least some of the voids of the series of voids at least partially laterally overlapping with the electrically conductive material;
• and
• a second stratum adjacent to the first stratum, the second stratum comprising:
• another quantity of the second dielectric material located on the first side of the first dielectric material partially over the electrically conductive material;
• and
• another series of voids defined by the other quantity of the second dielectric material and extending from the first dielectric material and the electrically conductive material at least partially through the other quantity of the second dielectric material, other footprints of at least some of the voids of the other series of voids at least partially laterally overlapping with the electrically conductive material;
• wherein each of the series of voids and the other series of voids remains free of occupying material within the series of voids and the other series of voids.