Heat pump apparatus
AssigneeMitsubishi Electric Corporation
InventorsYasuhiro Suzuki, Hirokazu Minamisako
Life of this patent
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Abstract
A heat pump apparatus includes: a refrigerant circuit configured to circulate refrigerant having flammability; a heat medium circuit configured to allow a heat medium to flow therethrough; a heat-medium heat exchanger configured to exchange heat between the refrigerant and the heat medium; an outdoor unit configured to accommodate the refrigerant circuit and the heat-medium heat exchanger; and an indoor unit configured to accommodate a part of the heat medium circuit, the outdoor unit including a refrigerant release valve, the refrigerant release valve being at least one of a pressure relief valve and an air purge valve which are provided in the heat medium circuit, the refrigerant release valve being provided outside a casing of the outdoor unit.
Claims8
A heat pump apparatus comprising:
- a refrigerant circuit configured to circulate refrigerant having flammability;
- a heat medium circuit configured to allow a heat medium to flow therethrough;
- a heat-medium heat exchanger configured to exchange heat between the refrigerant and the heat medium;
- an outdoor unit housing the refrigerant circuit and the heat-medium heat exchanger, the outdoor unit having at least a first chamber and a second chamber partitioned from the first chamber;
- an indoor unit housing a part of the heat medium circuit,
- the first chamber of the outdoor unit comprising a compressor of the refrigerant circuit, and
- the second chamber of the outdoor unit comprising
- a refrigerant release valve configured to release refrigerant contaminated into the heat medium, the refrigerant release valve being at least one of a pressure relief valve and an air purge valve which are provided in the heat medium circuit, and
- an air-blowing fan configured to blow outdoor air toward an air heat exchanger.
A heat pump apparatus comprising:
- a refrigerant circuit configured to circulate refrigerant having flammability;
- a heat medium circuit configured to allow a heat medium to flow therethrough;
- a heat-medium heat exchanger configured to exchange heat between the refrigerant and the heat medium;
- an outdoor unit configured to accommodate the refrigerant circuit and a part of the heat-medium heat exchanger;
- and
- an indoor unit configured to accommodate another part of the heat medium circuit,
- the refrigerant having a density larger than air density under an atmospheric pressure,
- the part of the heat medium circuit accommodated in the outdoor unit comprising a refrigerant release valve including at least one of a pressure relief valve and an air purge valve which are provided in the heat medium circuit as a refrigerant release valve and configured to release refrigerant contaminated into the heat medium,
- the outdoor unit having at least a first chamber in which an electrical component configured to cause the refrigerant circuit to operate is provided,
- the refrigerant release valve being provided in the first chamber at a position below the electrical component,
- the first chamber having a first ventilation port formed above the refrigerant release valve, and a second ventilation port formed below the refrigerant release valve.
Dependencies are inferred from the claim text.