Heat source device and substrate processing apparatus including same

A substrate processing apparatus, comprising:

• a chamber having an inner space in which a substrate is processed;
• a substrate support provided inside the chamber and supporting the substrate;
• and
• a heat source device comprising a supporting body provided in at least one side of the chamber, and a heat source unit provided parallel to the substrate support so as to heat the substrate,
• wherein the heat source unit comprises:
• a first light transmission conduit connected to the supporting body;
• a heat source provided inside the first light transmission conduit;
• and a first cooling conduit provided inside the first light transmission conduit while being spaced apart from the heat source, and having a first spraying hole for spraying a cooling gas;
• a supporting body in which an open hollow shape is defined in one side and a first insertion hole is defined in a side surface,
• wherein the first light transmission conduit is fixed into the first insertion hole and disposed to pass through the supporting body;
• wherein the first spraying hole is one of a plurality of first spraying holes, and at least two of the plurality of first spraying holes are spaced apart from each other in a longitudinal direction and a circumferential direction of the first cooling conduit.