Substrate bonding apparatus and bonding method using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsTaeyeong Kim, Minsoo Han, Jun Hyung Kim, Hoonjoo Na, Kwangjin Moon
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Abstract
A substrate bonding apparatus includes a lower chuck that receives a lower substrate and an upper chuck disposed above the lower chuck. An upper substrate is fixed to the upper chuck. The upper chuck and the lower chuck bond the upper substrate to the lower substrate. The upper chuck has an upper convex surface toward the lower chuck. The upper convex surface includes a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction.
Claims12
A substrate bonding apparatus, comprising:
- a lower chuck that receives a lower substrate;
- and
- an upper chuck disposed above the lower chuck,
- wherein an upper substrate is fixed to the upper chuck, and the upper chuck and the lower chuck bond the upper substrate to the lower substrate,
- wherein the upper chuck has an upper convex surface toward the lower chuck,
- wherein the upper convex surface comprises a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction,
- wherein the first ridges and the first valleys are disposed alternately at about every π/4 radian along the azimuthal direction.
A substrate bonding apparatus, comprising:
- a lower chuck that receives a lower substrate;
- and
- an upper chuck disposed above the lower chuck,
- wherein an upper substrate is fixed to the upper chuck, and the upper chuck and the lower chuck bond the upper substrate to the lower substrate,
- wherein the upper chuck has an upper convex surface toward the lower chuck,
- wherein the upper convex surface comprises a plurality of first ridges and a plurality of first valleys disposed alternately along an azimuthal direction,
- wherein the first ridges have a first curvature radius, the first valleys have a second curvature radius, and the first curvature radius is greater than the second curvature radius.
A substrate bonding apparatus, comprising:
- a lower chuck that loads a lower substrate;
- and
- an upper chuck disposed above the lower chuck,
- wherein an upper substrate is fixed to the upper chuck, and the upper chuck and the lower chuck bond the upper substrate to the lower substrate,
- wherein the upper chuck has an upper convex surface toward the lower chuck, and the upper convex surface is non-flat along an azimuthal direction,
- wherein the upper convex surface comprises:
- a plurality of ridges;
- and
- a plurality of valleys disposed between and below the ridges,
- wherein a pair of facing ridges are spaced apart at a first maximum linear distance, and a pair of facing valleys are spaced apart at a second maximum linear distance less than the first maximum linear distance.
A substrate bonding apparatus, comprising:
- a lower chuck that loads a lower substrate;
- and
- an upper chuck disposed above the lower chuck,
- wherein an upper substrate is fixed to the upper chuck, and the upper chuck and the lower chuck bond the upper substrate to the lower substrate,
- wherein the upper chuck has an upper convex surface toward the lower chuck, and the upper convex surface is non-flat along an azimuthal direction,
- wherein the lower chuck has a lower convex surface toward the upper chuck, and the lower convex surface is non-flat along the azimuthal direction.
Dependencies are inferred from the claim text.