Ultrasonic transducer device, ultrasonic probe, and ultrasonic apparatus
AssigneeSeiko Epson Corporation
InventorJiro Tsuruno
Life of this patent
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Abstract
An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.
Claims12
An ultrasonic transducer device comprising:
- a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets;
- and
- a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires,
- wherein the third wires include:
- through electrodes that penetrate through the second substrate in the thickness direction and are connected to the second wires, and
- conductive protrusions protruding toward the thickness direction via which the through electrodes are connected to the first wires, and
- wherein, for each corresponding through electrode, conductive protrusion, and transducer element, the conductive protrusions are disposed on a side of the through electrodes that is closer to the ultrasonic transducer elements in the thickness direction.
An ultrasonic transducer device comprising:
- a substrate;
- a plurality of second wires that are provided on the substrate;
- an insulating film that is provided to overlap the second wires;
- a plurality of ultrasonic transducer elements that are provided on the insulating film and are arranged in a matrix;
- a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets and that intersect the second wires in a plan view from a thickness direction of the substrate;
- and
- third wires via which the first wires are electrically connected to the second wires,
- wherein the third wires include:
- through electrodes that penetrate through the substrate in the thickness direction and are connected to the second wires, and
- conductive protrusions protruding toward the thickness direction via which the through electrodes are connected to the first wires, and
- wherein, for each corresponding through electrode, conductive protrusion, and transducer element, the conductive protrusions are disposed on a side of the through electrodes that is closer to the ultrasonic transducer elements in the thickness direction.
Dependencies are inferred from the claim text.