US 10,945,459 B1 · Plated silicon-based electronic cigarette atomizing chip and preparation method thereof

Abstract

A plated silicon-based electronic cigarette atomizing chip includes the following components: a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, the outer walls of the micro-pillars are plated side walls, the inner walls of the micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the micro-holes are provided on the silicon substrate; a glass cover, wherein the air holes passing through the glass cover are provided; and the glass cover is fixedly connected to the silicon substrate by a bonding process.

Claims7

Dependent claims

A plated silicon-based electronic cigarette atomizing chip, comprising the following components:

a silicon substrate, wherein the silicon substrate is provided with an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end, outer walls of the array of micro-pillars are plated side walls, inner walls of the array of micro-holes are plated inner walls, and the array of micro-pillars defines a plurality of micro-channels or electronic cigarette liquid channels penetrating the array of micro-holes are provided on the silicon substrate;
a glass cover, wherein air holes passing through the glass cover are provided;
and
the glass cover is fixedly connected to the silicon substrate by a bonding process.

1 more element

A method for preparing a plated silicon-based electronic cigarette atomizing chip, comprising the following steps:

a, etching an array of micro-pillars or an array of micro-holes, an inlet end, and an outlet end on a silicon substrate;
b, cleaning the silicon substrate after being etched in step a to obtain a clean electroplated surface of the silicon substrate;
c, plating outer walls of an array of micro-pillars or inner walls of an array of micro-holes by a plating method to obtain a plated silicon wafer;
d, manufacturing an array of air holes passing through a glass cover;
e, bonding the plated silicon wafer obtained in step c with the glass cover obtained in step d to obtain a bonded silicon wafer by a bonding process;
and
f, filling an inlet pipe or a liquid-guiding material at the inlet end of the bonded silicon wafer, filling an outlet pipe or the liquid-guiding material at the outlet end, then, inserting wires into the bonded silicon wafer to obtain the plated silicon-based electronic cigarette atomizing chip.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

16/763,560Filed 8 Aug 2019

Priority

CN 201910228763.425 Mar 2019

Published

US 2021/0052008 A125 Feb 2021

Granted

16 Mar 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification24 codes

A24F 40/70
Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially…:…
H05B 3/44
Non-flexible: heating conductor arranged within rods or tubes of insulating material
A24F 40/10
Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially…:…
A24F 40/46
Constructional details, e.g. connection of cartridges and battery parts: shape or structure of electric heating means

Plated silicon-based electronic cigarette atomizing chip and preparation method thereof

Life of this patent

Plated silicon-based electronic cigarette atomizing chip and preparation method thereof

Life of this patent

Abstract

Claims7