Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTakashi Tachikawa, Hidenori Miyagawa
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AssigneeToshiba Memory Corporation
InventorsTakashi Tachikawa, Hidenori Miyagawa
Estimating the term…
A semiconductor memory device comprises: a substrate; gate electrodes arranged in a first direction crossing a surface of the substrate; a first semiconductor layer including a first portion extending in the first direction and facing the plurality of gate electrodes, and, a second portion nearer to the substrate than the first portion; a gate insulating film provided between the gate electrode and the first portion of the first semiconductor layer, and, including a memory portion; and, a wiring portion provided between the substrate and the plurality of gate electrodes, connected to the second portion of the first semiconductor layer, and, extending in a second direction crossing the first direction. The wiring portion comprises a second semiconductor layer connected to the second portion of the first semiconductor layer. The second semiconductor layer includes a first crystal grain larger than a thickness in the first direction of the second semiconductor layer.
A semiconductor memory device, comprising:
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.