Power-module assembly with cooling arrangement

A power-module assembly comprising:

• a plurality of power modules each including a power stage and a frame defining a pocket adjacent to the power stage and slots disposed on opposing sides of the power stage, wherein the power modules are stacked in an array such that pockets adjacent to each other form coolant chambers interleaved with the power stages and such that slots adjacent to each other form coolant headers, wherein each of the power stages has at least one substrate including:
• first channels each configured to receive coolant from an associated pair of coolant headers,
• second channels substantially parallel to the first channels and each opening into a corresponding one of the coolant chambers to provide coolant thereto, and
• third channels crisscrossing the first and second channels to connect the first and second channels in fluid communication.

A power-module assembly having a plurality of power modules arranged in a stack, each power module comprising:

• a frame;
• and
• a power stage supported in the frame, the power stage including a plurality of switches supported on a substrate and configured to transform direct current into alternating current, the substrate including:
• an outer plate having opposing first and second edges, the outer plate defining first microchannels recessed into a back of the outer plate and oriented to extend between the opposing edges and defining second microchannels completely through a thickness of the outer plate, oriented to extend between the opposing edges, and positioned between the first microchannels such that the first and second microchannels alternate along the outer plate, and
• an interior plate having a front disposed against the back of the outer plate and defining third microchannels recessed into the front and oriented to crisscross the first and second microchannels such that the third microchannels connect the first and second microchannels in fluid communication.