Print circuit board and manufacturing method thereof

A method of manufacturing a printed circuit board, comprising:

• providing a first substrate and a first metal sheet, wherein each of the first substrate and the first metal sheet has a first surface and a second surface;
• coating the first surface of the first substrate with a first insulating layer;
• coating the first surface of the first metal sheet with a second insulating layer;
• placing the first substrate coated with the first insulating layer and the first metal sheet coated with the second insulating layer in an in a heating device and baking the first substrate and the first metal sheet at a first temperature to remove solvent of the first and second insulating layers so that the first and second insulating layers are semi-cured;
• and
• with the first surface of the first metal sheet facing to the first surface of the first substrate, bonding the semi-cured first insulating layer of the first substrate and the semi-cured second insulating layer of the first metal sheet through thermally pressing the semi-cured first and second insulating layers at a second temperature to cure the first and second insulating layers so as to form a third insulating layer between the first substrate and the first metal sheet and bond the first metal sheet to the first substrate through the third insulating layer,
• wherein
• each of the first insulating layer and the second insulating layer comprises a silicon-based polymer compound,
• the third insulating layer has a thickness less than 80 micro-meter and has a dielectric strength greater than 1 KV per 10 micro-meter, and
• the first substrate is an aluminum plate, a copper plate, an aluminum nitride plate or a composite metal plate.