Printed wiring board having embedded pads and method for manufacturing the same

A printed wiring board, comprising:

• a laminate comprising a plurality of first conductor pads on a first surface side of the laminate and a plurality of second conductor pads on a second surface side of the laminate;
• and
• a solder resist layer formed on the first surface side of the laminate and having a plurality of openings formed such that the openings are exposing the first conductor pads respectively,
• wherein the laminate includes a resin insulating layer and has a first surface on the first surface side and a second surface on the second surface side on an opposite side with respect to the first surface of the laminate, each of the second conductor pads has an embedded portion embedded in the second surface of the laminate and a protruding portion protruding from the second surface of the laminate such that the second conductor pads have surfaces exposed and protruding from the second surface of the laminate and that the embedded portion has a width that is substantially equal to a width of the protruding portion in a thickness direction of the laminate, the plurality of second conductor pads is formed on a center side of the second surface of the laminate, the laminate includes a plurality of third conductor pads formed on the second surface side of the laminate such that the third conductor ads are positioned on an outer peripheral side than the plurality of second conductor pads, embedded in the second surface of the laminate and have surfaces exposed from the second surface of the laminate respectively, and the plurality of second conductor pads is formed such that the plurality of second conductor pads has a pitch that is smaller than a pitch of the plurality of third conductor pads.