Method of manufacturing physical structure for high frequency signal transmission

A method of manufacturing a high frequency signal transmission structure, comprising:

• providing an insulating sheet, forming a silver bottom layer on the insulating sheet;
• forming a copper conductive layer on a part of the silver bottom layer;
• removing the silver bottom layer which is not covered by the copper conductive layer;
• and
• forming a silver covering layer on the copper conductive layer, wherein the copper conductive layer is surrounded by the silver bottom layer and the silver covering layer, the silver bottom layer, the copper conductive layer and the silver covering layer cooperatively form a conductive circuit, the copper conductive layer is a core of the conductive circuit, and the silver conductive layer and the silver covering layer cooperatively form a cladding layer wrapping the core of the conductive wiring layer.