Deskewing method for a physical layer interface on a multi-chip module
AssigneesAdvanced Micro Devices, Inc., ATI Technologies ULC
InventorsVarun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder
Life of this patent
Estimating the term…