Radio-frequency module and communication apparatus

A radio-frequency module comprising:

• a module substrate having a first main surface and a second main surface that face away from each other and a plurality of external-connection ground terminals;
• a circuit element mounted on the first main surface of the module substrate;
• and
• a switch IC mounted on the second main surface of the module substrate, wherein
• the circuit element has
• a circuit substrate,
• an input electrode and an output electrode that are disposed on the circuit substrate,
• a first ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals, and
• a second ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals,
• the first ground electrode is connected, on the circuit substrate, to an electrode or a wiring line that is disposed on the circuit substrate,
• the second ground electrode is not connected to either of the electrode and the wiring line that are disposed on the circuit substrate, and
• a distance between the first ground electrode and a first external-connection ground terminal connected to the first ground electrode is smaller than a distance between the second ground electrode and the first external-connection ground terminal connected to the second ground electrode in plan view of the module substrate.