Mask plate and thin-film encapsulation method

A thin-film encapsulation method, comprising following steps:

• providing a mask plate, wherein the mask plate includes a shielding region and an opening region, the shielding region surrounds the opening region, a shape and location of the opening region corresponds to a film forming region and a portion of a bonding region of a sub-pixel;
• aligning the mask plate with a glass substrate on which the sub-pixel provided and moving the mask plate to be close to the glass substrate;
• inputting a thin-film encapsulation material to pass through the opening region of the mask plate in order to form an encapsulation protection layer on the glass substrate, wherein the thin-film encapsulation material which passes through the opening region covers the film forming region and the portion of the bonding region of the sub-pixel to which the opening region corresponds, such that a flexible printed circuit (FPC) region and a testing port of the sub-pixel are not covered by the thin-film encapsulation material and are thus exposed;
• and
• separating the mask plate from the glass substrate, and inspecting a status of a thin film formed on the glass substrate;
• wherein the shielding region of the mask plate includes an outer frame and a stopping block extended from a middle portion of a bottom edge of the outer frame to an interior of the opening region of the mask plate and the opening region of the mask plate comprises a primary open space corresponding to the film forming region and secondary open spaces extending from and in communication with the primary open space to respectively define a first opening and a second opening at two sides of the stopping block to expose the portion of the bonding region of the sub-pixel, wherein the stopping block masks the FPC region on the sub-pixel.