US 10,873,016 B2Granted

Light-emitting device and method for manufacturing the same

AssigneeDexerials Corporation

InventorsHidetsugu Namiki, Keiji Honjo, Yasuyuki Higuchi

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Abstract

A light-emitting device and a method for manufacturing the same capable of suppressing connection defects of light-emitting elements and improving electrical connectivity. A substrate includes a first mounting region for mounting a first light-emitting element, a second mounting region for mounting a second light-emitting element, a first electrode connected to one electrode of the first light-emitting element and one electrode of the second light-emitting element, a second electrode formed in the first mounting region and connected to the other electrode of the first light-emitting element, and a third electrode formed in the second mounting region and connected to the other electrode of the second light-emitting element. In the first electrode, a groove is formed between the first mounting region and the second mounting region.

Claims14

Dependent claims

A light-emitting device comprising:

a first light-emitting element and a second light-emitting element each having a pair of electrodes on one surface;
a substrate having a first mounting region on which the first light-emitting element is mounted, a second mounting region on which the second light-emitting element is mounted, a first electrode having a groove formed between the first mounting region and the second mounting region and connected to one electrode of the first light-emitting element and one electrode of the second light-emitting element, a second electrode formed in the first mounting region and connected to the other electrode of the first light-emitting element, and a third electrode formed in the second mounting region and connected to the other electrode of the second light-emitting element;
a first anisotropic conductive film connecting the first light-emitting element to the first electrode and the second electrode;
and
a second anisotropic conductive film connecting the second light-emitting element to the first electrode and the third electrode.

2 more elements

A method for manufacturing a light-emitting device comprising:

a preparing step of preparing a first light-emitting element and a second light-emitting element each having a pair of electrodes on one surface, and a substrate having a first mounting region on which the first light-emitting element is to be mounted, a second mounting region on which the second light-emitting element is to be mounted, a first electrode having a groove formed between the first mounting region and the second mounting region, the first electrode to be connected to one electrode of the first light-emitting element and to one electrode of the second light-emitting element, a second electrode formed in the first mounting region, the second electrode to be connected to the other electrode of the first light-emitting element, and a third electrode formed in the second mounting region, the third electrode to be connected to the other electrode of the second light-emitting element;
a first mounting step of mounting the first light-emitting element onto the first mounting region using a first anisotropic conductive paste;
and
a second mounting step of mounting the second light-emitting element onto the second mounting region using a second anisotropic conductive paste.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 16/306,508Filed 2 May 2017
Priority: JP 2016-10826231 May 2016
Published: US 2019/0157537 A123 May 2019
Granted: 22 Dec 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

H10H 20/857
Packages: interconnections, e.g. lead-frames, bond wires or solder balls
H10W 90/00
Package configurations
H10H 20/0364
Of packages: of interconnections
H10H 20/853
Encapsulations: characterised by their shape

Family

US 2019/0157537 A1Pre-grant publication · published 23 May 2019
US 10,873,016 B2This patent

From the US filing history. Foreign family members aren’t listed.

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