LED light bulb having filament with layered light conversion layer

An LED light bulb, consisting of:

• a lamp housing doped with a golden yellow material or its surface coated with a yellow film;
• a bulb base connected to the lamp housing;
• a stem connected to the bulb base and located in the lamp housing, the stem comprises a stand extending to the center of the lamp housing;
• a single flexible LED filament, disposed in the lamp housing, the flexible LED filament comprising:
• a plurality of LED sections, each of the LED sections includes at least one LED chip;
• a plurality of conductive sections, located between the adjacent two LED sections, where each of the conductive sections includes a conductor, the conductor is copper foil;
• at least two conductive electrodes, respectively disposed corresponding to the LED sections and electrically connected to the LED sections;
• and
• a light conversion layer comprising a phosphor layer and a silicon layer superposed on the phosphor layer, disposed on the LED chips and at least two sides of the conductive electrodes, and a portion of the conductive electrodes is exposed by the light conversion layer, the LED chip comprising a upper surface and a lower surface opposite to the upper surface of the LED chip, wherein the phosphor layer directly contacts the upper surface of the LED chip, and a base layer contacts the lower surface of the LED chip;
• two conductive supports, each of the two conductive supports connected with both the stem and the flexible LED filament;
• and
• a driving circuit, electrically connected with the two conductive supports;
• a plurality of supporting arms, each of the supporting arms comprise a first end and a second end opposite to the first end of the supporting arms, the first end of each of the supporting arms is connected with the stand while the second end of each of the supporting arms is connected with the flexible LED filament;
• wherein the base layer is formed from organosilicon-modified polyimide resin composition comprising an organosilicon-modified polyimide and a thermal curing agent, wherein the organosilicon-modified polyimide comprises a repeating unit represented by the following general Formula (I):
• wherein Ar1 is a tetra-valent organic group having a benzene ring or an alicyclic hydrocarbon structure, Ar2 is a di-valent organic group having a monocyclic alicyclic hydrocarbon structure, R is each independently methyl or phenyl, n is 1˜5;
• wherein the organosilicon-modified polyimide has a number average molecular weight of 5000˜100000;
• wherein the thermal curing agent is selected from the group consisting of epoxy resin, isocyanate and bisoxazoline compounds.