Optoelectronic module having dual encapsulation with opening for receiving an optical assembly

An optoelectronic module comprising:

• first and second optical channels;
• a first active optoelectronic component disposed in the first optical channel;
• a second active optoelectronic component disposed in the second optical channel;
• a first region of transparent encapsulation over the first active optoelectronic component, and a second region of transparent encapsulation over the second active optoelectronic component, wherein the first and second regions of transparent encapsulations are composed of the same material as one another;
• opaque encapsulation on the first and second regions of transparent encapsulation, wherein the opaque encapsulation has a first opening over the first active optoelectronic component and a second opening over the second active optoelectronic component, the opaque encapsulation forming a ledge in an area of the second opening;
• an optical assembly disposed on the ledge within the second opening over the second active optoelectronic component;
• and
• a substrate on which the first and second optoelectronics are mounted,
• wherein the second region of transparent encapsulation extends to a height above the substrate less than a height to which first region of transparent encapsulation extends.