Chip size package, method of manufacturing the same, electronic device, and endoscope

A method of manufacturing a chip size package, the method comprising:

• applying sealing resin to a second substrate on which a plurality of solid-state imaging elements is formed;
• bonding a first substrate on which a plurality of light emitting elements is formed to the second substrate to which the sealing resin is applied, wherein the first substrate is bonded to the second substrate by a wafer level chip size package (WCSP) manufacturing method;
• and
• singulating the bonded first substrate and the second substrate, wherein the chip size package includes:
• a solid-state imaging element of the plurality of solid-state imaging elements configured to generate a pixel signal according to incident light;
• and
• a light emitting element of the plurality of light emitting elements configured to output irradiation light according to voltage applied, wherein the solid-state imaging element is integrated with the light emitting element.

An electronic device, comprising:

• a chip size package that includes a solid-state imaging element and a light emitting element, wherein
• the solid-state imaging element is integrated with the light emitting element,
• the solid-state imaging element is configured to generate pixel signal based on incident light,
• the light emitting element is configured to output irradiation light based on voltage applied,
• the light emitting element includes sapphire glass as a support substrate,
• the sapphire glass includes a light shielding groove,
• the light shielding groove extends from a top surface of the sapphire glass to a bottom surface of the sapphire glass, and
• the light shielding groove in the sapphire glass is at a boundary between the light emitting element and the solid-state imaging element.

An endoscope, comprising:

• a chip size package that includes a solid-state imaging element and a light emitting element, wherein
• the solid-state imaging element is integrated with the light emitting element,
• the solid-state imaging element is configured to generate a pixel signal based on incident light,
• the light emitting element is configured to output irradiation light based on voltage applied,
• the light emitting element includes sapphire glass as a support substrate,
• the sapphire glass includes a light shielding groove,
• the light shielding groove extends from a top surface of the sapphire glass to a bottom surface of the sapphire glass, and
• the light shielding groove in the sapphire glass is at a boundary between the light emitting element and the solid-state imaging element.