Method of manufacturing an enhanced high performance image sensor device
AssigneeDpix, LLC
InventorsRobert Rodriquez, Shawn Michael O'Rourke, Ick-Hwan Ko, Paul Carey
Life of this patent
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AssigneeDpix, LLC
InventorsRobert Rodriquez, Shawn Michael O'Rourke, Ick-Hwan Ko, Paul Carey
Estimating the term…
An image sensor includes a substrate, a thin film transistor on the substrate, a dielectric layer over the thin film transistor, a stacked metal layer on and extending through the dielectric layer to the thin film transistor, a bulk heterojunction layer directly coupled to the stacked metal layer, either a hole transport layer directly coupled to the bulk heterojunction layer, and a top contact layer directly coupled to the hole transport layer, or a top contact layer directly coupled to the bulk heterojunction layer. The bulk heterojunction layer includes an electron donor/acceptor material, the hole transport layer includes a transparent conductive polymer material, and the top contact layer includes a transparent conductive material. The image sensor includes a moisture barrier layer directly coupled to the top contact layer, including an optically clear adhesive and a laminated transparent barrier film.
An image sensor comprising:
An image sensor comprising:
An image sensor comprising:
Dependencies are inferred from the claim text.