Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorNayuta Kariya
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AssigneeToshiba Memory Corporation
InventorNayuta Kariya
Estimating the term…
According to one embodiment, first and second conductive layers are stacked in a first direction. The second conductive layers are spaced from the first conductive layers. Insulation regions are provided between the first and second conductive layers. A pillar is arranged between the first and second conductive layers and between the insulation regions. The pillar includes a charge storage film, a first insulation film, and a semiconductor layer, which are provided sequentially from the first conductive layers. A second insulation film is provided between the charge storage film and the first conductive layers. A portion of the charge storage film is provided between one of the insulation regions and the first conductive layers at an end of a portion where the first conductive layers and the pillar face each other.
A semiconductor memory device, comprising:
A semiconductor memory device, comprising:
Dependencies are inferred from the claim text.