Microelectronic packages with high integration microelectronic dice stack

A method of forming a microelectronic package, comprising:

• forming a microelectronic substrate having a die attachment surface and a plurality of pillars extending from the microelectronic substrate die attachment surface, wherein the plurality of pillars has an attachment material thereon;
• forming at least one first microelectronic die having an active surface and an opposing back surface;
• attaching the at least one first microelectronic die by the active surface thereof to the microelectronic substrate die attachment surface by a plurality of pillars of the at least one first microelectronic die and corresponding solder bumps on die attachment bond pads of the microelectronic substrate;
• forming at least one second microelectronic die having a plurality of pillars extending from an active surface thereof, the active surface opposite a back surface;
• attaching the at least one second microelectronic die to the microelectronic substrate, wherein each of the plurality of second microelectronic die pillars is attached to a respective microelectronic substrate pillar with the attachment material and wherein the at least one second microelectronic die extends over at least a portion of the at least one first microelectronic die;
• and
• disposing a mold material on the back surface of the at least one second microelectronic die.

An electronic system, comprising:

• a board;
• and
• a microelectronic package on the board, wherein the microelectronic package comprises:
• a microelectronic substrate having a die attachment surface and a plurality of pillars extending from the microelectronic substrate die attachment surface;
• at least one first microelectronic die having an active surface and an opposing back surface, the at least one first microelectronic die attached by its active surface to the microelectronic substrate die attachment surface by a plurality of pillars of the at least one first microelectronic die and corresponding solder bumps on die attachment bond pads of the microelectronic substrate;
• at least one second microelectronic die extending over at least a portion of the at least one first microelectronic die and having a plurality of pillars extending from an active surface thereof, the active surface opposite a back surface, wherein each of the plurality of second microelectronic die pillars is attached to a respective microelectronic substrate pillar with an attachment material;
• and
• a mold material on the back surface of the at least one second microelectronic die.