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US 10,872,879 B2Granted
Semiconductor package and manufacturing method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsJin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
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Abstract
A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
Claims20
A method of manufacture comprising:
- providing a substrate having:
- a substrate top surface having a substrate top first pad and a substrate top second pad,
- a substrate bottom surface having a substrate third pad and a substrate interconnect pad, and
- a substrate lateral surface;
- providing a first device on the substrate top surface and coupled to the substrate top first pad, the first device comprising:
- a first device bottom surface facing the substrate top surface,
- a first device lateral surface, and
- a first device top surface facing away from the substrate top surface;
- providing a second device component coupled to the substrate top second pad;
- providing a first encapsulant to encapsulate the substrate top surface, the first device, and the second device,
- the first encapsulant having:
- a first encapsulant top surface, and
- a first encapsulant lateral surface;
- attaching a third device to the substrate third pad on the substrate bottom surface, the third device comprising:
- a third device top surface facing the substrate bottom surface,
- a third device lateral surface, and
- a third device bottom surface facing away from the substrate bottom surface;
- providing a first interconnect on the substrate bottom surface and coupled to the substrate interconnect pad,
- the first interconnect comprising an interconnect protruded section and providing external interface to the semiconductor package;
- and
- applying a second encapsulant to encapsulate the substrate bottom surface and at least partially the third device and the first interconnect, the second encapsulant comprising:
- a second encapsulant bottom surface, and
- a second encapsulant lateral surface;
- wherein:
- the interconnect protruded section protrudes past the second encapsulant bottom surface;
- at least one of the first, second, or third devices is an electronic device;
- and
- at least one of the first, second, or third devices is a passive component.
25 more elements
A method of manufacture comprising:
- providing a substrate having
- a substrate top surface having a substrate top first pad and a substrate top second pad,
- a substrate bottom surface having a substrate third pad and a substrate interconnect pad, and
- a substrate lateral surface;
- providing a first device on the substrate top surface and coupled to the substrate top first pad, the first device comprising:
- a first device bottom surface facing the substrate top surface,
- a first device lateral surface, and
- a first device top surface facing away from the substrate top surface;
- providing a second device component coupled to the substrate top second pad;
- providing a first encapsulant that encapsulates the substrate top surface, the first device, and the second device,
- the first encapsulant having:
- a first encapsulant top surface, and
- a first encapsulant lateral surface;
- providing a third device on the substrate bottom surface and coupled to the substrate third pad, the third device comprising:
- a third device top surface facing the substrate bottom surface,
- a third device lateral surface, and
- a third device bottom surface facing away from the substrate bottom surface;
- providing a first interconnect on the substrate bottom surface and coupled to the substrate interconnect pad,
- the first interconnect comprising an interconnect protruded section and providing external interface to the semiconductor package;
- providing a second encapsulant that encapsulates the substrate bottom surface and at least partially the third device and the first interconnect, the second encapsulant comprising:
- a second encapsulant bottom surface, and
- a second encapsulant lateral surface;
- and
- providing a first electromagnetic interference (EMI) shield that bounds at least:
- the first encapsulant top surface,
- the first encapsulant lateral surface, and
- the substrate lateral surface;
- wherein:
- the third device bottom surface is exposed from the second encapsulant;
- the interconnect protruded section protrudes past the second encapsulant bottom surface;
- at least one of the first, second, or third devices is an electronic device;
- and
- at least one of the first, second, or third devices is a passive component.
30 more elements
Dependencies are inferred from the claim text.