Bonding apparatus and method of bonding substrates
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Ebin Liao, Wen-Chih Chiou
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Abstract
A bonding apparatus includes a chuck and a bonding head. The chuck is configured to carry a plurality of substrates to be bonded. The bonding head has a cavity facing the chuck and includes a divider, at least one pneumatic component and a diaphragm. The divider is disposed in the cavity and dividing the cavity into a plurality of compartments. The at least one pneumatic component is disposed in at least one of the compartments. The diaphragm covers the cavity and is disposed between the at least one pneumatic component and the chuck.
Claims20
A bonding apparatus, comprising:
- a chuck configured to carry a plurality of substrates to be bonded;
- and
- a bonding head having a cavity facing the chuck, comprising:
- a divider disposed in the cavity and dividing the cavity into a plurality of compartments;
- at least one pneumatic component disposed in at least one of the plurality of compartments;
- and
- a diaphragm covering the cavity and disposed between the at least one pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one pneumatic component is inflated.
A bonding apparatus, comprising:
- a chuck configured to carry a plurality of substrates to be bonded;
- and
- a bonding head having a cavity facing the chuck, wherein the chuck and the bonding head are configured to be movable relative to each other, and the bonding head comprises:
- a divider disposed in the cavity and dividing the cavity into a central compartment and a peripheral compartment surrounding the central compartment;
- at least one peripheral pneumatic component disposed in the peripheral compartment;
- and
- a diaphragm covering the cavity and disposed between the at least one peripheral pneumatic component and the chuck, wherein the diaphragm is configured to press against the plurality of substrates to be bonded when the at least one peripheral pneumatic components are inflated.
A bonding apparatus, comprising:
- a chuck configured to carry a plurality of substrates to be bonded;
- and
- a bonding head having a plurality of compartments facing the chuck, at least one pneumatic component disposed in at least one of the plurality of compartments and configured to be inflated or deflated, and a diaphragm covering the at least one pneumatic component.
Dependencies are inferred from the claim text.