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US 10,872,873 B2Granted
Method for bonding wafers and bonding tool
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien-Chih Chen, Tsung-Yi Yang, Chung-I Hung, Mu-Han Cheng, Tzu-Shin Chen, Su-Yu Yeh
Life of this patent
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Abstract
A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected.
Claims20
A method comprising:
- coupling a first wafer to a first support of a bonding tool and coupling a second wafer to a second support of the bonding tool;
- bonding the second wafer to the first wafer with the first wafer coupled to the first support;
- detecting whether a bubble is between the bonded first and second wafers in the bonding tool;
- and
- when a bubble is detected, transferring the bonded first and second wafers to a cleaning module of the bonding tool and performing a cleaning process on the bonded first and second wafers in the cleaning module, wherein detecting whether a bubble is between the bonded first and second wafers is in a same chamber of the bonding tool as bonding the second wafer to the first wafer.
2 more elements
A method comprising:
- coupling a first wafer to a first support of a first module and coupling a second wafer to a second support of the first module;
- bonding the second wafer to the first wafer with the first wafer coupled to the first support;
- capturing an image of the bonded first and second wafers after the bonded first and second wafers are moved from the first module to a transportation space and when the bonded first and second wafers are static at the transportation space;
- and
- moving the bonded first and second wafers from the transportation space to a second module after the capturing.
2 more elements
An apparatus comprising:
- a first wafer support configured to hold a first wafer;
- a second wafer support opposite to the first wafer support, wherein the second wafer support is configured to hold a second wafer and to release the second wafer onto the first wafer and is formed with an aperture that extends from a bottom surface to a top surface of the second wafer support, and the second wafer support is at least partially transparent to infrared radiation;
- a pin disposed in the aperture, extending through the bottom and top surfaces of the second wafer support, and configured to bond the second wafer to the first wafer;
- an infrared camera above the second wafer support;
- and
- a controller configured to control the infrared camera to capture an image of the bonded first and second wafers when the second wafer support releases the second wafer.
3 more elements
Dependencies are inferred from the claim text.