Semiconductor devices and methods of manufacturing the same

A method of manufacturing a semiconductor device, the method comprising:

• providing a semiconductor substrate;
• forming a redistribution line on a top surface of the semiconductor substrate;
• and
• forming a passivation layer to cover the redistribution line on the top surface of the semiconductor substrate,
• wherein the forming the redistribution line includes,
• a first stage of forming a first segment of the redistribution line on the top surface of the semiconductor substrate,
• a second stage of forming a second segment of the redistribution line on the first segment of the redistribution line, and
• a third stage of forming a third segment of the redistribution line on the top surface of the semiconductor substrate before performing the first stage, so that the performing the first stage forms the first segment on the third segment,
• wherein an average grain size of the second segment of the redistribution line is less than an average grain size of the first segment of the redistribution line.