Fan-out antenna packaging structure and preparation method thereof

A method for preparing a fan-out antenna packaging structure, comprising the following steps:

• 1) providing a carrier and forming a peeling layer on an upper surface of the carrier;
• 2) forming a redistribution layer on a surface of the peeling layer;
• 3) providing a semiconductor chip and mounting the semiconductor chip face-down on a surface of the redistribution layer;
• 4) forming a metal connecting wire on the surface of the redistribution layer by adopting a wire bonding process;
• 5) forming a plastic packaging material layer on the surface of the peeling layer, wherein the plastic packaging material layer fills a gap between the semiconductor chip and the metal connecting wire and a gap between the semiconductor chip and the redistribution layer;
• wherein the plastic packaging material encloses the semiconductor chip and the metal connecting wire;
• wherein the plastic packaging material layer comprises a first surface and a second surface opposite to each other, wherein the second surface of the plastic packaging material layer is in contact with the redistribution layer, and wherein the first surface of the plastic packaging material layer exposes an upper surface of the metal connecting wire;
• 6) forming an antenna structure on the first surface of the plastic packaging material layer, wherein the antenna structure is electrically connected with the metal connecting wire;
• wherein forming an antenna structure on the first surface of the plastic packaging material layer comprises the following steps:
• 6-1) forming a first dielectric layer on the first surface of the plastic packaging material layer;
• 6-2) forming a first opening in the first dielectric layer, wherein the first opening exposes the upper surface of the metal connecting wire;
• 6-3) forming a first metal plug in the first opening and forming a first layer of metal antennas on an upper surface of the first dielectric layer, wherein the first layer of metal antennas is electrically connected with the metal connecting wire through the first metal plug;
• 6-4) forming a second dielectric layer on the upper surface of the first dielectric layer on which the first layer of metal antennas are formed, wherein the second dielectric layer completely covers the first layer of metal antennas;
• 6-5) forming a second opening in the second dielectric layer, wherein the second opening exposes part of the first layer of metal antennas;
• and
• 6-6) forming a second metal plug in the second opening, and forming a second layer of metal antennas on the second dielectric layer;
• 7) removing the carrier and the peeling layer;
• and
• 8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer and is insulated from the plastic packaging material layer.