Fan-out antenna packaging structure and preparation method thereof

A method for preparing a fan-out antenna packaging structure, comprising the following steps:

• 1) providing a carrier and forming a peeling layer on an upper surface of the carrier;
• 2) mounting a semiconductor chip facing down on an upper surface of the peeling layer;
• 3) forming a metal connecting pole on the upper surface of the peeling layer;
• 4) forming a plastic packaging material layer on the upper surface of the peeling layer, wherein the plastic packaging material layer fills a gap between the semiconductor chip and the metal connecting pole, and encloses the semiconductor chip and the metal connecting pole;
• wherein the plastic packaging material layer comprises a first surface and a second surface opposite to the first surface, the second surface of the plastic packaging material layer is in contact with the peeling layer, and the first surface of the plastic packaging material layer exposes an upper surface of the metal connecting pole;
• 5) removing the carrier and the peeling layer;
• 6) forming a redistribution layer on the second surface of the plastic packaging material layer, wherein the redistribution layer is electrically connected with the semiconductor chip and the metal connecting pole;
• 7) forming an antenna structure on the first surface of the plastic packaging material layer, wherein the antenna structure is electrically connected with the metal connecting pole;
• wherein forming the antenna structure comprises:
• 7-1) forming a first dielectric layer on the first surface of the plastic packaging material layer;
• 7-2) forming a first opening in the first dielectric layer, wherein the first opening exposes the upper surface of the metal connecting pole;
• 7-3) forming a first metal plug in the first opening and forming a first layer of metal antennas on an upper surface of the first dielectric layer, wherein the first layer of metal antennas is electrically connected with the metal connecting pole through the first metal plug;
• 7-4) forming a second dielectric layer on the upper surface of the first dielectric layer on which the first layer of metal antennas is formed, wherein the second dielectric layer covers the first layer of metal antennas;
• 7-5) forming a second opening in the second dielectric layer, wherein the second opening exposes part of the first layer of metal antennas;
• and
• 7-6) forming a second metal plug in the second opening, and forming a second layer of metal antennas on the second dielectric layer;
• and
• 8) forming a solder ball bump on a surface of the redistribution layer, wherein the solder ball bump is electrically connected with the redistribution layer and insulated from the plastic packaging material layer.