Back to results
US 10,872,866 B2Granted
Semiconductor package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorJenchun Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor package including a substrate having a surface, and a conductive element on the first surface and electrically coupled to the substrate. The conductive element has a principal axis forming an angle less than 90 degrees with the surface.
Claims20
A semiconductor package, comprising:
- a substrate having a surface;
- a conductive element on the surface and electrically coupled to the substrate, wherein the conductive element has a top surface facing away from the surface of the substrate and a lateral surface, and the conductive element has a principal axis forming an angle less than 90 degrees with the surface;
- and
- an encapsulant surrounding the lateral surface of the conductive element and covering the surface of the substrate,
- wherein a first portion of the top surface of the conductive element is covered by the encapsulant, and a second portion of the top surface of the conductive element is exposed from the encapsulant;
- wherein the top surface and the lateral surface of the conductive element define a first corner adjacent to the first portion of the top surface and a second corner adjacent to the second portion of the top surface, wherein the second corner of the conductive element is exposed from the encapsulant.
3 more elements
A semiconductor package, comprising:
- a substrate having a first surface;
- a conductive element on the first surface, wherein the conductive element has a top surface facing away from the first surface of the substrate and a side surface;
- and
- an encapsulant covering the side surface of the conductive element,
- wherein a first portion of the top surface of the conductive element is covered by the encapsulant, and a second portion of the top surface of the conductive element is exposed from the encapsulant,
- wherein a second surface passes through the conductive element and the encapsulant, the second surface is parallel to the first surface, and a shape of the conductive element on the second surface is elliptical;
- wherein the top surface and the side surface of the conductive element define a first corner adjacent to the first portion of the top surface and a second corner adjacent to the second portion of the top surface, wherein the second corner of the conductive element is exposed from the encapsulant.
4 more elements
A method for manufacturing a semiconductor package, comprising:
- providing a substrate, the substrate having a surface;
- and
- placing a conductive element having a principal axis on the surface of the substrate by performing processes that comprise:
- picking the conductive element using an electrostatic force;
- releasing the conductive element on a position on the surface of the substrate;
- and
- forming an encapsulant on the surface of the substrate, wherein a first corner adjacent to a top surface of the conductive element is covered by the encapsulant and a second corner adjacent to the top surface of the conductive element is exposed from the encapsulant.
4 more elements
Dependencies are inferred from the claim text.